Record Details     « New Search       Brief Record Full Record MARC Record     Bibliographic Data Control Number UPD-00000177310 Date and Time of Latest Transaction 20090716221619.0 General Information 080209s1991 nyua 001 0 eng International Standard Book Number 087942267X Cataloging Source DENG Language Code eng Local Call Number TK 7870.15 M85 Title Statement Multichip modules : systems advantages, major constructions, and materials technologies / edited by R. Wayne Johnson, Robert K.F. Teng, John W. Balde Physical Description 603 p. Subject Added Entry - Topical Term Electronic packaging   Microelectronic packaging   Multichip modules (Microelectronics) Added Entry - Personal Name Johnson, R. Wayne, 1957-   Teng, Robert K. F.   Balde, John W., 1923- Collection Category FO Format Monograph Location UP DENG-II TK 7870.15 M85 UDEGB0015679 Regular Circulation E-ESEP-2083 Textual Physical Form Designator Book           Physical Location University of the Philippines Diliman: College of Engineering Library II TK 7870.15 M85           Digital Copy Not Available          Add to Book Cart  |   Download MARC