Record Details     « New Search       Brief Record Full Record MARC Record     Bibliographic Data Control Number UPD-00000175956 Date and Time of Latest Transaction 20090716222248.0 General Information 080209s1991 us 000 eng International Standard Book Number 0791808963 Cataloging Source DENG Language Code eng Local Call Number TK 7870.15 M36 1991 Title Statement Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman Physical Description v, 153 p. : ill Subject Added Entry - Topical Term Electronic packaging -- Congresses   Microelectronic packaging -- Congresses Added Entry - Corporate Name American Society of Mechanical Engineers. Applied Mechanics Division   American Society of Mechanical Engineers. Electrical and Electronic Packaging Division   American Society of Mechanical Engineers. Winter Meeting (1991 : Atlanta, Ga.) Collection Category FO Format Monograph Location UP DENG-II TK 7870.15 M36 1991 UDEGB0029741 Regular Circulation E-ESEP-0079 Textual Physical Form Designator Book           Physical Location University of the Philippines Diliman: College of Engineering Library II TK 7870.15 M36 1991           Digital Copy Not Available          Add to Book Cart  |   Download MARC