Record Details     « New Search       Brief Record Full Record MARC Record     Bibliographic Data Control Number UPD-00000169620 Date and Time of Latest Transaction 20090716221200.0 General Information 080209s1993 nyua 000 eng International Standard Book Number 0442010583 Language Code eng Local Call Number TK 7870.15 T54 Title Statement Thermal stress and strain in microelectronics packaging / edited by John H. Lau Physical Description xxii, 883 p. : ill Subject Added Entry - Topical Term *Electronic packaging   Microelectronic packaging   Thermal stresses Added Entry - Personal Name Lau, John H. Collection Category FO Format Paper Location UP DENG-II TK 7870.15 T54 UDEGB0024374 Regular Circulation E-28304   UP DENG-II TK 7870.15 T54 UDEGB0022906 Regular Circulation E-ESEP-2720   UP DENG-II TK 7870.15 T54 UDEGB0024374 Regular Circulation E-28304   UP DENG-II TK 7870.15 T54 UDEGB0022906 Regular Circulation E-ESEP-2720 Textual Physical Form Designator Book           Physical Location University of the Philippines Diliman: College of Engineering Library II TK 7870.15 T54           Digital Copy Not Available          Add to Book Cart  |   Download MARC