|
Your search for [subject]Electronic packaging -- Design returned 3 records. |
|
|
Sort by:
|
|
|
|
|
|
|
 |
Electronics packaging forum : multichip module technology issues.
New York: The Institute of Electrical and Electronics Engineers, 1994.
Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.
|
|
|
|
|
|
|
|
|
|
|
|
 |
Physical design for multichip modules.
by Sriram, M., (Mysore), 1966-; Boston: Kluwer Academic Pub., 1994.
Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.
|
|
|
|
|
|
|
|
|
|
|
|
 |
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability.
by Pecht, Michael; New York: Wiley, 1994.
Subject: Electronic packaging -- Design; Hybrid integrated circuits -- Design and construction; Multichip modules (Microelectronics) -- Design and construction.
|
|
|
|
|
|
|
|
|
|
|