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  Search result  Your search for [subject]Intermetallic compounds -- Thermal properties returned 2 records.  
 
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  Thesis Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (Cu OSP) substrate surface finish.

by Manauis, Melissa B.; 2007.

Subject: Solder and soldering; Intermetallic compounds -- Thermal properties.

  
     
Relevance: 31.91%
 
     
  Book Phenomenological study of thermal aging effects on intermetallic growth mechanism and shear strength behavior of wafer level solder bumps.

by Amistoso, Jose Omar S.;

Subject: Solder and soldering; Intermetallic compounds -- Thermal properties; Integrated circuits -- Wafer-scale integration.

  
     
Relevance: 30.30%
 
     
 
         
         
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