|
Your search for [subject]Microelectronic packaging -- Reliability returned 2 records. |
|
|
Sort by:
|
|
|
|
|
|
|
 |
Reliability of electronic packages and semiconductor devices.
by Di Giacomo, Giulio.; N.Y.: McGraw, 1997.
Subject: Semiconductors -- Reliability; Microelectronic packaging -- Reliability.
|
|
|
|
|
|
|
|
|
|
|
|
 |
The effect of copper oxides on the solder joint reliability of a cu-bumped flip chip package.
by Orofeo, Carlo M.; 2007.
Subject: Microelectronic packaging -- Reliability; Solder and soldering -- Testing; Multichip modules (Microelectronics); Copper oxide superconductor.
|
|
|
|
|
|
|
|
|
|
|