Search Results
 
  Search result  Your search for [subject]Integrated circuits -- Wafer-scale integration returned 3 records.  
 
Sort by:  
 
     
  Book Manufacturing yield evaluation of VLSI/WSI systems.

Los Alamitos, CA: IEEE Computer Society Press, 1995.

Subject: Integrated circuits -- Very large scale integration -- Design and construction -- Data processing; Integrated circuits -- Wafer-scale integration -- Design and construction -- Data processing; Integrated circuits -- Very large scale integration -- Reliability; Integrated circuits -- Wafer-scale integration -- Reliability; Integrated circuits -- Fault tolerance.

  
     
Relevance: 43.29%
 
     
  Thesis Phenomenological study of thermal aging effects on intermetallic growth mechanisms and shear strength behavior of wafer level solder bumps.

by Amistoso, Jose Omar S.; 2007.

Subject: Integrated circuits -- Wafer-scale integration; Solder and soldering; Shear (Mechanics).

  
     
Relevance: 36.58%
 
     
  Book Phenomenological study of thermal aging effects on intermetallic growth mechanism and shear strength behavior of wafer level solder bumps.

by Amistoso, Jose Omar S.;

Subject: Solder and soldering; Intermetallic compounds -- Thermal properties; Integrated circuits -- Wafer-scale integration.

  
     
Relevance: 35.84%
 
     
 
         
         
Online Catalog
Basic Search
Advanced Search
Browse Subjects
Book Cart
 
         

Text Size:
S  -  M  -  L
Copyright © 2004-2025. Philippine eLib Project
Host: U.P. Diliman University Library