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Your search for [subject]Electronic packaging returned 36 records. |
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Quality conformance and qualification of microelectronic packages and interconnects.
New York: Wiley, 1994.
Subject: Electronic packaging -- Defects; Electronic packaging -- Quality control; Electronic packaging -- Testing; Quality assurance.
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Multichip modules : systems advantages, major constructions, and materials technologies.
New York: IEEE Press, 1991.
Subject: Electronic packaging; Microelectronic packaging; Multichip modules (Microelectronics).
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Thermal stress and strain in microelectronics packaging.
New York: Van Nostrand Reinhold, 1993.
Subject: Electronic packaging; Microelectronic packaging; Thermal stresses.
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High temperature electronics.
London: Chapman & Hall, 1997.
Subject: Electronic apparatus and appliances -- Thermal properties; Electronic packaging; Heat resistant materials.
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Ceramic interconnect technology handbook.
by Barlow, Fred D.; Boca Raton, FL: CRC Press Taylor & Francis Group, 2007.
Subject: Electronic packaging -- Materials; Electronic ceramic; Interconnects (Integrated circuit technology) -- Design and construction.
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Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991.
New York: The Society, 1991.
Subject: Electronic packaging -- Congresses; Microelectronic packaging -- Congresses.
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Electronic techniques : shop practices and construction.
by Villanucci, Robert S., 1944-; Englewood Cliffs, N.J.: Prentice Hall, 1996.
Subject: Electronic apparatus and appliances -- Design and construction; Electronic packaging.
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Electronic techniques : shop practices and construction.
by Villanucci, Robert S.; Englewood Cliffs, N.J.: Prentice Hall, 1996.
Subject: Electronic apparatus and appliances -- Design and construction; Electronic packaging.
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Principles of electronic packaging.
New York: McGraw-Hill, 1989.
Subject: Electronic packaging.
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Electronic packaging : design, materials, process, and reliability.
New York: McGraw-Hill, 1998.
Subject: Electronic packaging.
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