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Your search for [subject]Microelectronic packaging returned 14 records. |
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Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications.
New York: Wiley, 1995.
Subject: Microelectronic packaging -- Materials; Microencapsulation; Plastics in packaging.
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Multichip modules : systems advantages, major constructions, and materials technologies.
New York: IEEE Press, 1991.
Subject: Electronic packaging; Microelectronic packaging; Multichip modules (Microelectronics).
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Thermal stress and strain in microelectronics packaging.
New York: Van Nostrand Reinhold, 1993.
Subject: Electronic packaging; Microelectronic packaging; Thermal stresses.
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MEMS & microsystems : design and manufacture.
by Hsu, Tai-Ran; Boston: McGraw-Hill, 2002.
Subject: Microelectronics; Microelectromechanical systems; Microelectronic packaging.
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Microelectronics packaging handbook.
New York: Chapman & Hall, 1997.
Subject: Microelectronic packaging - Handbooks, manuals, etc.
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Polymers in microelectronics : fundamentals and applications.
by Martynenko, Zoya,; Amsterdam ;: Elsevier, 1989.
Subject: Microelectronics -- Materials; Polymers; Microelectronic packaging.
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Chip scale package (CSP) : design, materials, processes, reliability, and applications.
by Lau, John H.; New York: McGraw-Hill, 1999.
Subject: Integrated circuits -- Design and construction; Microelectronic packaging.
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Polymer thick film.
by Gilleo, Ken.; New York: Van Nostrand Reinhold, 1996.
Subject: Thick-film circuits -- Materials; Polymers; Microelectronic packaging.
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Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991.
New York: The Society, 1991.
Subject: Electronic packaging -- Congresses; Microelectronic packaging -- Congresses.
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The effect of copper oxides on the solder joint reliability of a cu-bumped flip chip package.
by Orofeo, Carlo M.; 2007.
Subject: Microelectronic packaging -- Reliability; Solder and soldering -- Testing; Multichip modules (Microelectronics); Copper oxide superconductor.
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